Qualcomm Unveils AI, 5G, and Wi-Fi Innovations at Mobile World Congress
At Mobile World Congress (MWC) in Barcelona, Qualcomm unveiled a suite of cutting-edge AI, 5G, and Wi-Fi devices, promising to usher in a new era of intelligent computing. These innovations aim to transform industries, devices, and consumer experiences by harnessing the power of artificial intelligence, next-generation connectivity, and seamless wireless communication.
Qualcomm AI Hub: Unleashing On-Device AI
Qualcomm’s AI Hub takes center stage, featuring a comprehensive library of over 75 pre-optimized AI models designed for seamless deployment on Snapdragon and Qualcomm platforms. Developers can effortlessly integrate these models into their applications, reducing time-to-market and unlocking the benefits of on-device AI. With immediacy, reliability, privacy, personalization, and cost savings, on-device AI empowers users with powerful capabilities at their fingertips.
AI Research: Pushing the Boundaries of Generative AI
Qualcomm’s AI research showcases groundbreaking advancements in generative AI. On Windows PCs, the world’s first on-device demonstration of a 7+ billion parameter LMM showcases multi-turn conversations based on text and audio inputs. On smartphones, flagship commercial AI smartphones powered by the Snapdragon 8 Gen 3 Mobile Platform display exciting generative AI features like AI-generated image expansion, video creation, and calendar creation.
Snapdragon X80 5G Modem-RF System: The Future of 5G Connectivity
The Snapdragon X80 5G Modem-RF System emerges as the world’s most advanced 5G modem-to-antenna platform, integrating 5G-Advanced capabilities and fully integrated NB-NTN satellite communications support. With a second-generation 5G AI processor, it enhances cellular performance, coverage, latency, and power efficiency. This seventh-generation RF system for 5G, powered by AI, promises 20% better speeds at the cell’s edge and introduces the first AI-based multi-antenna management system, ensuring that 5G reaches everyone.
Qualcomm FastConnect 7900: Unifying AI-Optimized Connectivity
The Qualcomm FastConnect 7900 mobile connectivity system marks a milestone as the first to deliver AI-optimized performance. Integrating Wi-Fi 7, Bluetooth, and Ultra Wideband technologies into a single chip, it adapts to specific use cases and environments, optimizing power consumption, network latency, and throughput. With AI at its core, FastConnect 7900 enhances connectivity and enables new proximity capabilities in the next generation of devices.
AI-Powered Enhancements for Network Management
Qualcomm’s 5G Infrastructure showcases AI-based enhancements for network management, including a generative AI assistant for RAN engineers, an AI-based open RAN application that reduces network energy consumption, and an AI-based 5G network slice lifecycle management suite. These advancements empower network operators with intelligent tools to optimize network performance and efficiency.
Qualcomm’s innovations at MWC 2023 herald a new era of intelligent computing, where AI, 5G, and Wi-Fi technologies converge to transform industries and empower consumers with unprecedented experiences. From on-device AI to AI-enhanced connectivity, Qualcomm’s latest offerings pave the way for a future where technology seamlessly integrates into our lives, making them more productive, convenient, and enjoyable.